When Intel gave an outlook on upcoming storage technology in South Korea a few weeks ago, no questions were asked about the 3D Xpoint v2 – there was more information on-site: like the EE Times reportedly, the non-volatile memory is expected to have four instead of two layers of cells, which is likely to be 256 GB instead of 128 GB per die.
So far Intel sells all kinds of Optane products, so storage modules and SSDs are marketed with 3D Xpoint, the first generation: These include many solid state drives such as the Optane SSD P4800X (Coldstream), the Optane SSD 905P or the Optane Memory H10. In the server segment, Intel also offers the Optane Datacenter Persistent Memory (Apache Pass), ie DDR4-compatible NV-DIMMs with up to 512 GB per memory module.
In the future, Intel intends to use the 3D Xpoint v2 for new NV-DIMMs called Barlow Pass and new SSDs called Alderstream. Unlike the first generation, the second was no longer developed jointly with Micron because the IMFT joint venture of the two partners was dissolved. Intel is researching storage class memory such as 3D Xpoint v2 in the Fab 11X in Rio Rancho, New Mexico, but production is currently still in the works of Micron.
Apart from Intel and Micron, other manufacturers are also working on storage class memory, although so far there are only declarations of intent and no products. Western Digital, for example, wants to use 3D-ReRAM, but since 2016 nothing has been heard of it. Samsung and Toshiba, on the other hand, have developed special SLC flash memory (Z-NAND & XL flash), but this does not achieve the very low latency of 3D Xpoint.